Critical dimension measurement tools for Semiconductor Industry Market | Latest Analysis, Demand Trends, Growth Forecast

Critical dimension measurement tools for Semiconductor Industry Market size, process node migration, and segmentation outlook

Critical dimension measurement tools for Semiconductor Industry Market value is estimated at USD 2.9 billion in 2026, supported by continued expansion of advanced logic and memory fabrication capacity, rising adoption of gate-all-around transistor structures, and tighter overlay tolerance requirements in sub-5 nm production lines. Critical dimension (CD) measurement systems are process control and metrology tools used to quantify linewidth, feature spacing, sidewall profile, overlay accuracy, and pattern fidelity during semiconductor wafer manufacturing. These systems are integrated across lithography, etch, deposition, CMP, and inspection stages to maintain yield stability and process repeatability.

The product ecosystem includes:

Segment Type	Major Tool Categories	Key Use Areas
Optical CD Metrology	Scatterometry, OCD systems	High-volume process monitoring
Electron Beam CD Systems	CD-SEM	Advanced node critical dimension verification
X-ray Metrology	Hybrid dimensional characterization	Advanced packaging and 3D structures
AFM-based CD Measurement	CD-AFM	FinFET and nanosheet profile analysis
Inline Metrology Platforms	Integrated process control tools	Real-time fab monitoring

From an application perspective, logic semiconductor manufacturing accounts for the largest share of demand, estimated above 46% of total Critical dimension measurement tools for Semiconductor Industry Market revenue in 2026. Foundry investments in Taiwan, South Korea, the United States, and Japan continue to expand metrology intensity per wafer start due to shrinking process geometries and increasing multi-patterning complexity.

Memory manufacturers are also increasing deployment of CD measurement systems because NAND layer counts have exceeded 300 layers commercially, while DRAM manufacturers are tightening process windows for EUV-enabled nodes. In advanced packaging, hybrid bonding and chiplet architectures are generating additional demand for dimensional verification systems capable of sub-micron accuracy.

Lithography complexity and process control intensity supporting Critical dimension measurement tools for Semiconductor Industry demand

The transition toward 3 nm and 2 nm manufacturing is increasing the number of metrology steps per wafer substantially. Advanced logic fabs now use more than 1,500 process control measurement points across critical production stages, compared with fewer than 900 in older 14 nm manufacturing lines. This increase directly benefits the Critical dimension measurement tools for Semiconductor Industry Market because linewidth variability tolerance has narrowed significantly.

Taiwan remains the largest demand center. In April 2025, Taiwan Semiconductor Manufacturing Company accelerated installation activities for its Kaohsiung and Hsinchu advanced fabs targeting 2 nm production capacity exceeding 100,000 wafers per month. Each advanced fab requires large-scale deployment of CD-SEM, optical critical dimension systems, and overlay metrology platforms to maintain yield targets in EUV production environments.

In South Korea, Samsung Electronics expanded its advanced semiconductor investment program in 2025 with additional process control infrastructure for gate-all-around transistor manufacturing. GAA transistor architecture increases dimensional complexity because nanosheet width uniformity directly affects transistor performance and leakage characteristics. This has increased demand for high-resolution electron beam metrology systems capable of measuring buried structures and sidewall roughness.

The United States is also becoming a stronger contributor to Critical dimension measurement tools for Semiconductor Industry demand due to fab localization initiatives. In March 2025, Intel Corporation continued equipment installation activities under its Ohio and Arizona expansion programs. Process control tools account for a meaningful share of fab equipment expenditure because yield optimization has become a major cost determinant in advanced-node economics.

The semiconductor industry’s capital intensity is becoming increasingly tied to metrology capability rather than only wafer processing equipment. EUV lithography systems alone cannot guarantee dimensional accuracy without corresponding CD measurement infrastructure. This relationship has strengthened the position of metrology suppliers within semiconductor equipment spending cycles.

Optical critical dimension systems maintain volume dominance across high-throughput fabs

Optical critical dimension metrology continues to represent the largest technology segment within the Critical dimension measurement tools for Semiconductor Industry Market. Scatterometry and optical CD platforms are widely used because they provide fast inline measurement capability compatible with high-volume manufacturing conditions.

Optical systems are estimated to account for nearly 44% of market revenue in 2026. Their dominance is linked to:

• High wafer throughput capability
• Lower operating cost compared with e-beam systems
• Inline process integration
• Compatibility with AI-based process analytics
• Real-time statistical process control applications

Foundries operating mature nodes between 28 nm and 90 nm continue to rely heavily on optical metrology because automotive ICs, industrial semiconductors, power management chips, and display driver ICs require stable dimensional consistency but not always atomic-scale inspection resolution.

China has become a major deployment region for optical CD systems due to expansion of domestic mature-node fabrication capacity. In June 2025, Semiconductor Manufacturing International Corporation increased capacity utilization across several mature-node fabs supporting automotive and industrial semiconductor demand. These fabs require cost-efficient inline metrology systems optimized for production throughput.

Demand is also rising from compound semiconductor manufacturing. Gallium nitride and silicon carbide wafer fabrication lines increasingly use dimensional metrology systems for power electronics production. Electric vehicle inverter demand growth across China, Europe, and the United States is indirectly increasing demand for CD process monitoring systems in wide-bandgap semiconductor fabrication.

CD-SEM systems gaining higher share in advanced logic and memory manufacturing

Electron beam critical dimension systems are expanding faster than the broader market because advanced nodes require sub-nanometer measurement precision. CD-SEM tools are becoming central to advanced logic process control, especially for EUV lithography pattern verification.

The CD-SEM segment is projected to record one of the highest growth rates through 2032 due to:

Demand Driver	Impact on Tool Adoption
EUV lithography scaling	Increased mask and wafer measurement intensity
GAA transistor adoption	More complex 3D dimensional analysis
High-bandwidth memory growth	Tighter process tolerances
3D NAND layer expansion	Greater structural complexity
AI accelerator demand	Higher advanced wafer output

In February 2025, SK hynix expanded HBM production infrastructure for AI accelerator memory supply. High-bandwidth memory manufacturing involves highly precise patterning and vertical interconnect formation, increasing dependence on CD-SEM and overlay measurement systems.

Japan continues to play a major role in the supply side of electron beam metrology systems. Japanese semiconductor equipment manufacturers maintain strong market positions in precision optics, electron beam control systems, vacuum technologies, and nanoscale imaging components. This ecosystem advantage supports continued exports of semiconductor metrology systems to Taiwan, Korea, China, Singapore, and the United States.

The growing use of AI servers is also influencing the Critical dimension measurement tools for Semiconductor Industry Market indirectly. AI accelerators use advanced packaging, chiplet integration, and high-density interconnect structures requiring tighter dimensional verification during manufacturing. This is increasing metrology intensity per wafer and per package.

Advanced packaging and heterogeneous integration changing metrology requirements

Semiconductor packaging has shifted from a backend assembly function toward a performance optimization stage. As a result, dimensional measurement requirements now extend beyond front-end wafer processing.

Advanced packaging applications generating strong demand include:

• 2.5D packaging
• 3D IC integration
• Hybrid bonding
• Chiplet architectures
• Fan-out wafer-level packaging
• HBM stacking

In August 2025, ASE Technology Holding expanded advanced packaging capacity in Taiwan to support AI and HPC semiconductor demand. Hybrid bonding and chip stacking processes require sub-micron alignment verification, increasing use of dimensional metrology systems in backend operations.

This trend is changing the supplier landscape because packaging facilities historically used less sophisticated metrology infrastructure than leading-edge fabs. Now, advanced packaging facilities increasingly deploy high-resolution optical and X-ray dimensional analysis tools.

The automotive semiconductor sector is another important contributor. Automotive chips require high reliability standards, especially for ADAS, EV powertrain, and autonomous driving applications. Reliability qualification procedures involve extensive process monitoring and dimensional verification during wafer fabrication.

Europe remains a major automotive semiconductor demand center. In Germany, automotive semiconductor localization programs and EV production expansion are supporting stable demand for mature-node semiconductor fabrication and associated process control tools.

Regional production concentration and investment flows influencing the Critical dimension measurement tools for Semiconductor Industry Market

Asia Pacific accounts for the dominant share of manufacturing demand because Taiwan, South Korea, China, and Japan collectively represent the largest concentration of advanced semiconductor fabrication facilities globally.

Regional demand structure in 2026 is estimated as follows:

Region	Estimated Market Share
Asia Pacific	71%
North America	18%
Europe	8%
Other Regions	3%

Taiwan alone represents a major concentration point for advanced metrology deployment because of its foundry ecosystem density. EUV-enabled fabs operating in Taiwan require continuous process calibration and inline dimensional monitoring.

South Korea maintains strong demand from memory manufacturing. NAND and DRAM scaling are increasing process complexity because stacked architectures require precise layer-to-layer dimensional consistency.

China continues expanding mature-node semiconductor capacity. Government-backed investment programs supporting local semiconductor manufacturing are increasing installation of process control systems across 200 mm and 300 mm fabs.

North America is gaining relevance due to semiconductor reshoring initiatives. In 2025, multiple fabs under construction in Arizona, Texas, and Ohio continued equipment procurement activities involving lithography support systems and metrology infrastructure.

Japan remains critical on the supply side rather than purely demand side. Precision motion systems, optics, vacuum components, electron beam modules, and semiconductor measurement subsystems from Japanese manufacturers remain deeply integrated into the global semiconductor metrology supply chain.

Asia Pacific manufacturing concentration shaping Critical dimension measurement tools for Semiconductor Industry Market production dynamics

Asia Pacific accounts for the largest share of production and deployment activity in the Critical dimension measurement tools for Semiconductor Industry Market, with the region estimated to contribute nearly 72% of total semiconductor metrology equipment consumption in 2026. The concentration is directly linked to advanced wafer fabrication clusters across Taiwan, South Korea, Japan, and China. These countries collectively control a dominant share of global logic foundry output, advanced memory manufacturing, and semiconductor packaging capacity, creating sustained demand for critical dimension metrology infrastructure.

Taiwan remains the most influential production hub from the demand side because of its advanced-node foundry concentration. Logic production below 5 nm is heavily centered in Taiwan, where EUV lithography intensity per wafer is among the highest globally. Critical dimension measurement tools are deeply integrated into these production lines because transistor scaling below 3 nm requires measurement precision within sub-nanometer tolerances.

In January 2026, Taiwan Semiconductor Manufacturing Company continued volume ramp-up activities for 2 nm manufacturing in Hsinchu and Kaohsiung. Combined investment across the company’s advanced node infrastructure exceeded USD 32 billion for ongoing fab and process equipment expansion programs. Higher EUV layer counts in these fabs are increasing deployment of CD-SEM and optical scatterometry systems across lithography and etch stages.

Taiwan’s role extends beyond semiconductor production. The country also houses strong semiconductor ecosystem integration involving mask manufacturing, wafer handling systems, advanced packaging, and process control engineering. This ecosystem density lowers process optimization time and accelerates adoption of new metrology technologies.

Regional production share within semiconductor metrology demand

Country/Region	Estimated Share in Semiconductor Metrology Equipment Demand
Taiwan	28%
South Korea	19%
China	17%
United States	15%
Japan	11%
Europe	7%
Others	3%

South Korea driving high-value demand through memory scaling and HBM production

South Korea represents one of the largest high-value markets for Critical dimension measurement tools for Semiconductor Industry applications due to its dominance in DRAM and NAND manufacturing. Memory fabrication requires extensive dimensional monitoring because layer stacking complexity continues to increase.

Commercial NAND structures have crossed 300-layer architecture thresholds, while advanced DRAM production increasingly relies on EUV-enabled process integration. Both transitions increase dependence on high-resolution metrology.

In March 2025, Samsung Electronics announced additional investment allocation for semiconductor production infrastructure in Pyeongtaek focused on advanced memory and AI-oriented semiconductor capacity. A substantial portion of this spending was directed toward process control systems because yield degradation risks rise sharply at higher layer counts and smaller geometries.

At the same time, SK hynix expanded HBM production lines targeting AI accelerator demand growth. High-bandwidth memory production involves advanced TSV formation, wafer thinning, and hybrid bonding steps that require dimensional verification at multiple stages.

South Korea’s semiconductor exports exceeded USD 130 billion in 2025, supported by strong AI server and accelerator demand. The increase in HBM shipments has indirectly strengthened the Critical dimension measurement tools for Semiconductor Industry Market because AI-related memory devices require tighter process control compared with conventional consumer memory products.

China increasing mature-node and domestic semiconductor equipment localization

China has emerged as a major contributor to global semiconductor fabrication capacity growth, particularly across mature-node manufacturing. While advanced-node access remains constrained by export controls, domestic investment in 28 nm, 45 nm, and specialty semiconductor production continues at a large scale.

In July 2025, Semiconductor Manufacturing International Corporation expanded production utilization across automotive and industrial semiconductor lines following continued domestic demand growth in EVs and industrial automation. China’s electric vehicle production crossed 13 million units in 2025, increasing demand for power semiconductors, MCUs, analog ICs, and automotive controllers.

These manufacturing expansions are increasing demand for optical critical dimension systems because mature-node fabs prioritize throughput and cost-efficient inline process monitoring.

China is also attempting to strengthen domestic semiconductor equipment capability. Local metrology tool development programs have accelerated under state-backed semiconductor initiatives. Although domestic suppliers still trail Japanese and American companies in high-end CD-SEM capability, local suppliers are gaining adoption in mature-node production environments.

Segment demand split within Critical dimension measurement tools for Semiconductor Industry Market

Segment	Estimated Revenue Share
Optical CD Metrology	44%
CD-SEM Systems	33%
Overlay Metrology	12%
AFM-Based CD Tools	6%
Hybrid/X-ray Systems	5%

Optical systems maintain larger volume share because of broad use across mature-node fabs, while CD-SEM systems generate higher average selling prices due to technological complexity.

Japanese precision engineering ecosystem maintaining supply-side dominance

Japan plays a different role within the Critical dimension measurement tools for Semiconductor Industry Market. Rather than dominating semiconductor output volume, Japan maintains strong control over critical subsystem manufacturing, electron beam technologies, optics, and ultra-precision instrumentation.

Japanese semiconductor equipment manufacturers continue supplying high-end metrology platforms and subsystems to fabs across Taiwan, Korea, the United States, Singapore, and Europe. Precision stage systems, vacuum chambers, electron optics modules, sensors, and imaging technologies produced in Japan remain difficult to replace because semiconductor metrology requires extremely high measurement repeatability.

In April 2025, Rapidus Corporation accelerated pilot line construction activities for advanced logic production in Hokkaido with support from Japanese government semiconductor funding programs exceeding USD 8 billion equivalent. The project is increasing domestic demand for advanced process control systems and dimensional metrology tools.

Japan’s semiconductor equipment exports also continue benefiting from broader global fab construction activity. Multiple fabs under development in North America and Southeast Asia still depend heavily on Japanese metrology components and subsystems.

United States strengthening process control investments through semiconductor reshoring

The United States has become a stronger production and demand region for semiconductor metrology systems due to ongoing fab localization initiatives and AI semiconductor expansion. Federal semiconductor incentives have accelerated investment in advanced logic and packaging infrastructure.

In February 2026, Intel Corporation continued installation of advanced manufacturing equipment across Ohio and Arizona facilities targeting leading-edge process technologies. Process control systems are consuming a growing share of fab equipment budgets because yield management costs rise significantly at advanced nodes.

The United States also benefits from strong semiconductor equipment ecosystem capabilities. Several major process control and metrology technology providers are headquartered in the country, supporting domestic innovation in electron beam imaging, AI-based defect analytics, and overlay metrology.

AI accelerator demand is becoming a major driver for the Critical dimension measurement tools for Semiconductor Industry Market in North America. AI GPUs and high-performance processors require advanced packaging, HBM integration, and complex interconnect architectures. These production requirements increase dimensional measurement intensity throughout fabrication and packaging processes.

Advanced packaging capacity expansion in the United States is also contributing to metrology demand growth. Heterogeneous integration and chiplet-based architectures require tighter bonding alignment accuracy and interposer dimensional verification.

Europe maintaining specialized semiconductor production demand

Europe accounts for a smaller share of semiconductor wafer output but maintains strategic importance in automotive semiconductors, industrial electronics, and power semiconductor production.

Germany remains the largest regional demand center because of automotive electronics manufacturing and industrial automation equipment production. European automotive semiconductor demand continues increasing due to EV electrification and ADAS integration.

In May 2025, Infineon Technologies expanded power semiconductor production initiatives linked to EV and renewable energy applications. Silicon carbide and power device manufacturing require dimensional process monitoring during epitaxy, lithography, and etch stages, increasing deployment of metrology systems in specialty semiconductor lines.

Europe’s industrial semiconductor ecosystem is less concentrated around advanced logic compared with Taiwan or South Korea. However, demand for high-reliability chips used in automotive, aerospace, and industrial control applications supports steady utilization of critical dimension measurement systems.

Production dynamics shifting toward higher metrology intensity per wafer

The most important production-side change in the Critical dimension measurement tools for Semiconductor Industry Market is not only rising wafer output but increasing metrology intensity per wafer processed.

Several manufacturing shifts are contributing to this trend:

• Higher EUV layer counts in advanced logic
• Transition to gate-all-around transistor structures
• Increased use of backside power delivery
• Hybrid bonding growth in advanced packaging
• Rising HBM manufacturing complexity
• Greater automotive semiconductor reliability requirements

Advanced fabs now use substantially more metrology steps than previous-generation manufacturing lines. This increases recurring demand for process control systems even when wafer production growth is moderate.

Another structural shift is the growing integration of AI into semiconductor process control. Machine learning-based process analytics are improving defect prediction and dimensional drift monitoring. As fabs attempt to reduce scrap and improve yield learning cycles, semiconductor manufacturers are deploying integrated metrology platforms capable of real-time process correction.

Major manufacturers controlling the Critical dimension measurement tools for Semiconductor Industry Market

The Critical dimension measurement tools for Semiconductor Industry Market remains highly consolidated because advanced semiconductor metrology requires expertise in electron optics, high-speed imaging, AI-assisted analytics, vacuum engineering, nanoscale measurement algorithms, and inline process integration. A limited number of suppliers currently possess the capability to support sub-5 nm production environments and high-volume semiconductor fabs.

The top five companies collectively account for more than 80% of global semiconductor process control and dimensional metrology revenue in 2026. Market concentration is strongest in CD-SEM systems, where qualification requirements are extremely stringent due to advanced node process sensitivity.

Estimated market share by major players in semiconductor CD metrology and inspection

Company	Estimated Share in Critical Dimension Measurement & Adjacent Process Control Segments
KLA Corporation	34%
Hitachi High-Tech Corporation	18%
Applied Materials	14%
Nova Ltd.	9%
Onto Innovation	7%
Other players	18%

The market leadership position of KLA is linked to its extensive installed base across logic, memory, and advanced packaging fabs. The company maintains strong penetration in optical CD metrology, defect inspection, and integrated process control platforms used by leading foundries and memory manufacturers.

KLA Corporation maintaining leadership in CD-SEM and process control infrastructure

KLA Corporation remains the largest supplier in the Critical dimension measurement tools for Semiconductor Industry Market because of its broad process control ecosystem covering CD-SEM, optical inspection, overlay metrology, reticle inspection, and yield management analytics.

Its critical dimension and e-beam inspection portfolio includes:

• eDR and eSL series e-beam inspection systems
• 29xx and 39xx inspection platforms
• Archer overlay metrology systems
• SpectraShape optical CD systems
• PROLITH process modeling software

KLA benefits from very high exposure to advanced logic production, particularly at Taiwanese and Korean foundries. EUV lithography adoption has increased demand for high-resolution dimensional monitoring tools capable of identifying stochastic patterning defects and line edge roughness.

In April 2025, KLA introduced the 3935 and 3920 EP broadband plasma inspection systems targeted at advanced logic and memory nodes below 5 nm. The systems were designed to improve defect sensitivity and process monitoring throughput in high-density semiconductor production environments.

The company also continues expanding AI-enabled process analytics integration. Advanced fabs increasingly combine dimensional metrology outputs with machine learning algorithms to reduce yield learning cycles and process drift.

Hitachi High-Tech strengthening position in advanced CD-SEM platforms

Hitachi High-Tech Corporation remains one of the most important suppliers of CD-SEM systems used in advanced semiconductor production. The company has a strong installed base in logic and memory manufacturing facilities across Japan, Taiwan, South Korea, and the United States.

Its semiconductor metrology product lines include:

• GT2000 CD-SEM series
• CG6300 review SEM systems
• High-resolution e-beam metrology platforms
• Hybrid process control solutions

The company’s electron beam imaging capability is particularly important for advanced nodes where optical methods alone cannot measure nanoscale variations accurately. High-NA EUV lithography development is also increasing reliance on electron beam-based dimensional analysis because smaller feature sizes create tighter process tolerances.

In February 2025, semiconductor metrology research presentations at SPIE Advanced Lithography highlighted multi-technique CD shape measurement workflows involving Hitachi High-Tech SEM systems for advanced node model validation.

Hitachi High-Tech benefits from Japan’s broader precision engineering ecosystem involving optics, vacuum technologies, and electron beam subsystem manufacturing. This ecosystem continues to support the company’s strong position in advanced semiconductor metrology.

Applied Materials expanding hybrid metrology and e-beam inspection capability

Applied Materials has increased its focus on hybrid metrology, combining optical and electron beam inspection technologies with AI-driven analytics platforms.

Its metrology and inspection offerings include:

• SEMVision e-beam inspection systems
• VeritySEM metrology platform
• ExtractAI analytics software
• Optical wafer inspection systems
• Integrated process control solutions

Applied Materials has positioned hybrid metrology as a key growth area because semiconductor manufacturers increasingly combine data from multiple inspection methods to improve yield accuracy.

In February 2025, Applied Materials introduced the SEMVision H20 e-beam inspection platform designed for advanced semiconductor nodes requiring higher throughput and improved defect classification capability. The system targeted advanced logic and memory fabs where increasing EUV layer counts are raising inspection intensity.

The company also benefits from broader integration across semiconductor fabrication ecosystems because many fabs already use Applied Materials deposition, CMP, etch, and process equipment. This allows tighter integration between manufacturing and process control infrastructure.

Nova Ltd. gaining share through optical metrology and materials characterization

Nova Ltd. has expanded its position in optical CD metrology and materials characterization systems used in advanced semiconductor fabrication.

Nova’s product portfolio includes:

• Nova PRISM metrology systems
• Nova Metrion integrated metrology platforms
• Nova i500 optical CD systems
• Chemical and dimensional materials analysis platforms

The company is particularly active in optical metrology for advanced logic and memory applications. As 3D NAND structures become taller and more complex, manufacturers increasingly require integrated dimensional and materials characterization rather than standalone measurement systems.

Nova has also benefited from growth in advanced packaging and heterogeneous integration. Hybrid bonding architectures and backside power delivery schemes require more complex inline dimensional verification.

The company’s market share remains smaller than KLA or Hitachi High-Tech, but Nova continues gaining relevance in high-value process control applications involving advanced materials engineering.

Onto Innovation building presence in advanced packaging metrology

Onto Innovation has expanded rapidly in advanced packaging and specialty semiconductor metrology applications. The company was formed through the merger of Nanometrics and Rudolph Technologies and now supplies process control equipment for semiconductor manufacturing, packaging, MEMS, and compound semiconductor production.

Its semiconductor metrology offerings include:

• Atlas optical metrology systems
• Dragonfly inspection platforms
• EchoScan analysis systems
• Packaging process control tools

Onto Innovation has benefited from rising demand for:

• Fan-out wafer-level packaging
• 2.5D integration
• HBM packaging
• Silicon photonics
• Compound semiconductors

The advanced packaging segment is becoming increasingly important in the Critical dimension measurement tools for Semiconductor Industry Market because AI accelerators and chiplet-based architectures require tighter interconnect alignment accuracy.

Competitive structure shifting toward integrated process control ecosystems

The Critical dimension measurement tools for Semiconductor Industry Market is no longer centered only on standalone measurement hardware. Semiconductor manufacturers increasingly prefer integrated process control ecosystems combining:

• Optical metrology
• E-beam inspection
• Overlay measurement
• Defect analytics
• AI-based process prediction
• Yield management software

This shift favors suppliers capable of providing end-to-end process control platforms rather than isolated tools.

Advanced logic and memory fabs are also increasing procurement preference for suppliers capable of supporting High-NA EUV transition requirements. High-NA EUV lithography introduces narrower process windows and higher stochastic defect sensitivity, increasing demand for high-resolution dimensional measurement systems.

Recent developments and semiconductor metrology industry updates

• In April 2025, KLA Corporation launched the 3935 and 3920 EP broadband plasma inspection systems targeting advanced logic and memory process nodes below 5 nm.
• In February 2025, Applied Materials introduced the SEMVision H20 e-beam inspection system designed to improve advanced-node defect classification throughput.
• In March 2026, imec received ASML’s High-NA EUV lithography system to accelerate 2 nm process readiness, increasing future demand for advanced CD metrology infrastructure.
• In 2025, advanced memory manufacturers including Samsung Electronics and SK hynix continued HBM and 3D NAND expansion programs, increasing deployment of CD-SEM and hybrid metrology systems for vertical memory structures.
• In 2025, multiple semiconductor fabs under construction in Arizona, Texas, Ohio, Taiwan, and Japan increased procurement of inline metrology systems as part of advanced-node localization and AI semiconductor manufacturing investments.