Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market | Latest Analysis, Demand Trends, Growth Forecast

Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market Trends Linked to EUV Expansion and AI Semiconductor Capacity Growth

The Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market is estimated at approximately USD 6.8 billion in 2026, with advanced lithography materials accounting for more than 38% of total industry revenue. Demand acceleration is increasingly concentrated around EUV photoresists, anti-reflective coatings, developers, removers, and specialty cleaning chemistries used in sub-7 nm production. The market is also seeing a measurable shift toward high-purity formulations as wafer manufacturers increase logic density and advanced packaging complexity. In 2026, nearly 72% of advanced logic wafer starts are concentrated in Taiwan, South Korea, and the United States, creating highly localized demand clusters for semiconductor-grade lithography chemicals.

Material consumption intensity has increased alongside rising layer counts in high-bandwidth memory (HBM), gate-all-around transistor architectures, and chiplet packaging. A leading-edge logic wafer processed at 3 nm consumes substantially higher volumes of specialty lithography chemicals than a 14 nm wafer due to multiple EUV exposure steps and tighter defect control requirements. Taiwan alone is projected to account for more than 30% of global semiconductor photoresist consumption in 2026 because of aggressive leading-edge node migration by major foundries. At the same time, China continues expanding mature-node fabrication capacity, increasing demand for KrF and ArF immersion photoresists used in automotive and industrial semiconductors.

In February 2025, Taiwan Semiconductor Manufacturing Company announced additional advanced packaging and wafer fabrication investments exceeding USD 28 billion across Taiwan and overseas facilities. These projects are increasing long-term demand for chemically amplified resists, edge bead removers, and wafer cleaning materials. Similarly, in April 2025, Samsung Electronics expanded high-bandwidth memory production lines in South Korea to support AI accelerator demand, directly increasing lithography chemical consumption per wafer processed.

“Lithography process sensitivity is increasing as semiconductor manufacturers move toward EUV production and tighter pattern fidelity requirements. This keeps Photoresists and Ancillary Chemicals for Semiconductor Manufacturing closely aligned with Photomasks and Reticles for Semiconductor Lithography, where resist chemistry directly affects exposure accuracy. The market also overlaps with Advanced Pellicles for EUV and DUV Lithography supporting contamination control in advanced lithography systems. Expanding wafer protection requirements are further increasing linkage with Wafer Edge Protection Films and Coatings. “

Advanced Lithography Transition Raising Consumption Intensity Across the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market

The transition from deep ultraviolet lithography toward EUV-based manufacturing remains the strongest structural demand driver for the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market. EUV production requires photoresists with significantly tighter line-edge roughness control, higher sensitivity, and improved stochastic defect performance. These technical requirements have raised the importance of ultra-high-purity resin chemistry and filtration technologies.

By 2026, EUV layers in leading-edge logic manufacturing are projected to exceed 25 layers per advanced processor in several high-performance computing applications. This increase is directly expanding consumption of underlayers, bottom anti-reflective coatings (BARC), developers, and stripping solutions. Semiconductor manufacturers are also using multiple patterning strategies for advanced DRAM and NAND structures, creating recurring chemical usage throughout fabrication cycles.

Japan maintains a critical upstream role in this ecosystem. Japanese suppliers continue to dominate high-purity photoresist materials and ancillary formulations used in advanced lithography processes. More than 70% of global EUV photoresist supply in 2026 remains associated with Japanese chemical manufacturers due to their expertise in purification, polymer chemistry, and contamination control. South Korean and Taiwanese manufacturers remain heavily dependent on imported semiconductor-grade resist materials despite localized expansion initiatives.

The complexity of lithography chemistry has also increased qualification cycles. Semiconductor fabs now require extended defectivity testing before introducing new resist formulations into production lines. In advanced logic production, even minor metallic contamination can significantly reduce yield, making purification capability a major competitive differentiator among suppliers.

AI Accelerators and High-Bandwidth Memory Fabrication Expanding Specialty Chemical Demand

AI infrastructure deployment has become one of the strongest downstream demand catalysts for the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market. GPU accelerators, AI inference processors, and HBM devices require advanced lithography and packaging architectures with higher process complexity than conventional consumer electronics semiconductors.

In March 2026, SK hynix expanded HBM production capacity at its Cheongju facilities to support AI server deployments. Increased HBM layer stacking and fine-pitch interconnect manufacturing are generating additional demand for photoresist stripping agents, dielectric patterning materials, and wet process chemicals. HBM manufacturing requires extremely low defect density because yield loss compounds across vertically stacked memory layers.

The growth in AI server infrastructure is also influencing substrate and packaging chemical demand. Advanced packaging technologies such as 2.5D integration, fan-out wafer-level packaging, and chiplet architectures require thick-film photoresists, temporary bonding materials, and specialty developers. Packaging-related lithography chemical demand is expanding faster than conventional front-end lithography chemical demand in several Asian manufacturing hubs.

Data center semiconductor demand continues to alter wafer mix distribution globally. Logic and HBM wafer starts associated with AI infrastructure are projected to grow by more than 18% in 2026, while smartphone-related mature-node growth remains comparatively moderate. This transition is shifting chemical demand toward higher-value formulations rather than commodity semiconductor process chemicals.

China’s Mature-Node Expansion Supporting KrF and ArF Resist Consumption

While advanced-node production attracts significant attention, mature-node semiconductor expansion remains a major volume driver for the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market. China continues to add substantial fabrication capacity focused on power semiconductors, automotive electronics, industrial controllers, and analog ICs.

In July 2025, Semiconductor Manufacturing International Corporation increased production output at multiple domestic fabrication facilities following continued investment in 28 nm and above process technologies. These facilities primarily consume KrF and ArF immersion photoresists along with associated developers and cleaning chemistries. Automotive semiconductor localization efforts in China are particularly increasing demand for mature-node lithography materials.

China’s domestic semiconductor equipment and materials localization policies are also influencing supply chain diversification. Several Chinese chemical producers have expanded semiconductor-grade purification capability between 2024 and 2026 to reduce dependence on Japanese imports. However, advanced EUV-grade resist localization remains technologically challenging because contamination thresholds are extremely stringent.

The automotive semiconductor segment is becoming a stable demand contributor for ancillary chemicals. Electric vehicles contain substantially higher semiconductor content compared to internal combustion vehicles, especially in power management, sensors, ADAS systems, and battery control modules. Mature-node automotive chips require high-volume lithography processing, sustaining demand for standard resist chemistries even as leading-edge nodes dominate industry headlines.

Supply Constraints and Purity Requirements Continue Challenging Semiconductor Chemical Producers

The production environment for semiconductor-grade photoresists and ancillary chemicals remains highly concentrated. Ultra-high-purity solvents, polymers, photoacid generators, and specialty additives require tightly controlled manufacturing environments with extensive filtration and analytical testing capabilities.

A major challenge in the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market is the long qualification timeline associated with introducing new materials into semiconductor fabrication facilities. Qualification periods for advanced lithography materials can exceed 12 months because fabs prioritize process stability over rapid supplier substitution. This creates strong entry barriers for emerging suppliers.

Supply chain risks also remain elevated due to concentration in a limited number of countries. Japan continues dominating critical raw material supply for advanced photoresists, while Taiwan and South Korea account for a large share of downstream semiconductor consumption. Any disruption involving trade controls, logistics constraints, or fluorochemical supply can affect global semiconductor manufacturing output.

In October 2024, the Japanese government expanded semiconductor material investment support programs targeting domestic supply chain resilience and advanced chemical manufacturing. These initiatives supported additional capacity expansion in semiconductor-grade resist materials and filtration systems. The move was closely linked to increasing global competition around semiconductor self-sufficiency and strategic material security.

Environmental compliance is becoming another operational pressure point. Semiconductor chemical manufacturing involves solvent handling, fluorinated compounds, and waste treatment systems requiring high capital expenditure. Several fabs in Taiwan and South Korea are increasing recycling rates for process chemicals and ultrapure water systems to manage environmental compliance costs and water availability concerns.

Demand Visibility Improving with Long-Term Fab Investments

Long-term fab construction activity continues strengthening visibility for the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market. Semiconductor manufacturing facilities under construction across the United States, Taiwan, Japan, South Korea, and Europe are creating multi-year demand pipelines for lithography materials.

In January 2025, Intel Corporation continued advanced fab expansion projects in the United States supported by CHIPS Act funding initiatives. These facilities are expected to increase domestic consumption of advanced lithography materials and ancillary semiconductor chemicals over the next several years. Similarly, European semiconductor investment programs are increasing regional demand for specialty process chemicals used in automotive and industrial semiconductor production.

Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market Supply Chain Concentration Across Japan, Taiwan, South Korea, and China

The global supply structure of the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market remains highly concentrated, particularly in advanced lithography materials. In 2026, Japan accounts for nearly 47% of global semiconductor-grade photoresist production value, largely because of its dominance in chemically amplified resists, photoacid generators, ultra-high-purity solvents, and polymer materials used in EUV and ArF immersion lithography. The country also maintains leadership in ancillary formulations including bottom anti-reflective coatings, edge bead removers, developers, and semiconductor-grade stripping solutions.

Taiwan and South Korea dominate downstream consumption rather than upstream raw material manufacturing. Together, both countries account for approximately 44% of global advanced lithography chemical consumption in 2026 because of dense concentration of memory and foundry manufacturing capacity. Taiwan alone processes more than 16 million 300 mm equivalent wafers annually across advanced and mature nodes, creating exceptionally high recurring demand for lithography-related process chemicals.

Production concentration has become even more visible with EUV scaling. More than 80% of EUV photoresist supply remains tied to Japanese manufacturers and associated chemical purification ecosystems. EUV materials require contamination levels below parts-per-trillion thresholds for metallic impurities, making supply chain replication extremely difficult. This technical barrier has limited large-scale supplier diversification despite significant government-backed localization programs in China and the United States.

In August 2025, JSR Corporation expanded advanced lithography material production capacity in Japan to support rising EUV resist demand from Asian foundries. The expansion was directly linked to increasing wafer starts for AI processors and high-bandwidth memory devices. Around the same period, Tokyo Ohka Kogyo increased semiconductor chemical output focused on advanced ArF and EUV-compatible materials.

Semiconductor Manufacturing Capacity Expansion Reshaping Regional Chemical Demand

The Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market is closely tied to regional wafer fabrication investment cycles. Taiwan remains the single largest consumption hub because of concentrated leading-edge logic production. In 2026, Taiwan is estimated to represent nearly 32% of total global semiconductor lithography chemical demand.

In March 2025, Taiwan Semiconductor Manufacturing Company accelerated installation schedules for advanced 2 nm manufacturing infrastructure in Hsinchu and Kaohsiung. These facilities are increasing demand for EUV-specific resist chemistries, developers, and contamination-control chemicals. Advanced nodes consume substantially higher ancillary chemical volumes because multiple exposure and cleaning stages are required during wafer processing.

South Korea remains heavily weighted toward DRAM and NAND production. Memory fabs consume large quantities of KrF, ArF, and specialty patterning materials because of multi-layer deposition and etching sequences used in advanced memory architectures. In January 2026, Samsung Electronics expanded Pyeongtaek semiconductor line investments focused on HBM and AI memory production. This expansion increased regional demand for dielectric patterning photoresists and wet cleaning chemicals used in high-layer-count memory structures.

China has emerged as the fastest-growing volume market for mature-node lithography chemicals. The country accounts for approximately 24% of global semiconductor wafer capacity additions between 2024 and 2026, primarily in 28 nm and above technologies. Automotive semiconductors, industrial power devices, analog ICs, and display driver chips remain major demand contributors.

In June 2025, Hua Hong Semiconductor expanded specialty wafer fabrication capacity targeting automotive and power semiconductor applications. These mature-node fabs significantly increase consumption of KrF and i-line photoresists along with associated developers and stripping agents. China’s mature-node expansion is supporting volume growth for conventional lithography materials even as advanced-node materials attract higher margins.

Market Segmentation Patterns in the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Industry

The Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market shows clear segmentation differences based on lithography technology, node size, and downstream semiconductor application.

Segmentation Highlights

• By Photoresist Type
  • ArF immersion photoresists account for approximately 34% of total market revenue in 2026 due to widespread use in advanced logic and memory manufacturing.
  • EUV photoresists represent the fastest-growing segment with annual growth exceeding 14% because of 3 nm and 2 nm node migration.
  • KrF photoresists maintain strong volume demand from automotive and industrial semiconductor production.
  • I-line and g-line photoresists continue serving MEMS, power semiconductor, and specialty analog applications.
• By Ancillary Chemical Type
  • Developers and removers contribute nearly 29% of ancillary chemical consumption.
  • Anti-reflective coatings remain critical for sub-10 nm lithography precision.
  • Edge bead removers and cleaning formulations show higher growth in advanced packaging applications.
  • Semiconductor-grade wet chemicals used alongside lithography account for increasing process integration demand.
• By Application
  • Advanced logic chips generate the highest value demand for EUV-compatible materials.
  • DRAM and HBM production remain major consumers of ArF immersion photoresists.
  • Automotive semiconductors support large-volume KrF resist demand.
  • Advanced packaging and chiplet manufacturing are expanding thick-resist consumption.
• By Geography
  • Asia Pacific accounts for more than 78% of total semiconductor lithography chemical demand in 2026.
  • Taiwan, South Korea, Japan, and China remain the dominant production-consumption cluster.
  • North America shows accelerated growth because of new fab investments supported by CHIPS Act incentives.
  • Europe maintains demand strength in automotive and industrial semiconductor manufacturing.

Demand Trend and Adoption Statistics Across Semiconductor End Uses

Demand trends in the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market increasingly reflect AI infrastructure investment and advanced packaging adoption rather than traditional smartphone-driven growth alone. In 2026, AI accelerator-related semiconductor production is projected to increase by more than 22% globally, while HBM wafer demand is expected to rise by nearly 28%. These technologies require finer patterning precision and additional lithography process steps, increasing chemical consumption intensity per wafer.

Advanced packaging adoption has become another important demand trend. More than 55% of high-performance processors entering production in 2026 are expected to use chiplet-based or heterogeneous integration architectures. These manufacturing flows rely heavily on thick-film photoresists, redistribution layer materials, and specialized stripping chemistries. Demand for packaging-related lithography chemicals in Taiwan and South Korea is growing faster than conventional front-end lithography chemical demand.

Automotive electronics is contributing stable long-cycle demand growth. Electric vehicle semiconductor content in 2026 is estimated to exceed USD 1,350 per premium battery electric vehicle, compared with below USD 700 in conventional internal combustion vehicles. Increased semiconductor integration in ADAS, battery management systems, radar modules, and powertrain electronics continues supporting mature-node wafer production and associated lithography chemical demand.

Regional Supply Security Programs Increasing Localized Production Investments

Governments are increasingly treating semiconductor materials as strategic industrial assets. Japan, the United States, South Korea, China, and the European Union have all introduced funding mechanisms supporting domestic semiconductor chemical ecosystems between 2024 and 2026.

In November 2024, the Japanese Ministry of Economy, Trade and Industry supported additional semiconductor materials investment programs targeting advanced lithography supply resilience. Several projects focused on ultra-high-purity solvent production and fluorinated chemical processing required for semiconductor manufacturing.

The United States is also expanding domestic chemical infrastructure tied to semiconductor fabrication. New wafer fabrication projects in Arizona, Texas, Ohio, and New York are increasing regional demand for locally sourced developers, strippers, and process chemicals. However, North America still depends heavily on imported advanced photoresists and high-purity precursor materials from Japan.

Europe’s position remains more specialized. Germany, France, and Italy continue supporting automotive semiconductor manufacturing and industrial chip production, sustaining regional demand for mature-node lithography materials. European semiconductor chemical consumption is increasingly linked to power electronics and silicon carbide manufacturing associated with electric vehicle growth.

Supply Risks and Purification Challenges Limiting Rapid Capacity Diversification

Despite aggressive localization strategies, supply diversification remains constrained by purification complexity and qualification requirements. Semiconductor-grade photoresists require multi-stage filtration, molecular-level impurity analysis, and stable batch-to-batch performance across long production cycles. Even small variations in chemical composition can reduce wafer yield at advanced nodes.

Raw material concentration also creates vulnerability. Specialty fluorochemicals, high-purity solvents, and photoactive compounds are sourced from a relatively limited supplier network. Any disruption involving trade restrictions, logistics bottlenecks, or environmental compliance issues can affect semiconductor production continuity.

Water and energy intensity are emerging operational concerns as well. Semiconductor chemical facilities in Taiwan and South Korea are investing heavily in solvent recycling and ultrapure water recovery systems to manage manufacturing costs and environmental constraints. These operational upgrades are becoming increasingly important as semiconductor fabs scale toward higher wafer throughput and more chemically intensive manufacturing processes.

Competitive Structure in the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market Remains Highly Consolidated

The Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market is dominated by a relatively small group of Japanese, South Korean, Taiwanese, and U.S.-linked suppliers with deep specialization in semiconductor-grade purification, polymer chemistry, and defect-control technologies. In 2026, the top five manufacturers collectively account for nearly 68% of global market revenue for advanced semiconductor photoresists and associated lithography chemicals. Entry barriers remain exceptionally high because semiconductor fabs require long qualification cycles, stable molecular consistency, and ultra-low contamination thresholds before approving new chemical suppliers.

Japanese companies continue to dominate the advanced photoresist segment, particularly EUV-compatible materials. Japan-based suppliers account for more than 70% of global EUV photoresist shipments in 2026, supported by decades of expertise in photoacid generators, fluorinated materials, and ultra-high-purity processing technologies. Meanwhile, South Korean and Taiwanese companies are expanding local production capability for ancillary chemicals including developers, removers, and specialty wet-process materials.

The competitive environment in the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market is also shifting because of regional supply chain localization policies. Governments in China, the United States, South Korea, and Europe are encouraging domestic semiconductor material ecosystems through subsidies and strategic industrial funding. However, advanced lithography chemistry still remains concentrated among established suppliers because leading-edge fabs prioritize yield stability over rapid supplier diversification.

Major Manufacturers and Market Share Trends in Semiconductor Lithography Chemicals

JSR Corporation remains one of the largest suppliers in the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market, with estimated global market share between 17% and 19% in 2026. The company maintains strong positioning in EUV photoresists, ArF immersion resists, bottom anti-reflective coatings, and advanced patterning materials. JSR’s semiconductor materials portfolio is widely qualified by leading foundries and memory manufacturers for advanced-node production. The company’s EUV-compatible resist materials are increasingly used in 3 nm and pilot-scale 2 nm production environments.

Tokyo Ohka Kogyo continues holding a major share in advanced and mature-node lithography materials. TOK supplies ArF, KrF, and EUV photoresists along with developers and cleaning formulations. Its TArF and advanced chemically amplified resist platforms remain heavily utilized in memory and logic fabs across Taiwan and South Korea. The company has also expanded semiconductor-grade chemical purification capacity to support rising demand from AI semiconductor manufacturing.

Shin-Etsu Chemical maintains strong positioning in semiconductor lithography materials and high-purity process chemicals. The company’s semiconductor business benefits from vertical integration across silicon wafers and specialty materials. Shin-Etsu’s photoresist-related portfolio includes advanced lithography materials and ancillary formulations optimized for defect reduction in high-density semiconductor manufacturing.

Fujifilm Holdings has strengthened its semiconductor materials division substantially over the past several years. Fujifilm Electronic Materials supplies photoresists, developers, cleaning solutions, and CMP-related formulations for semiconductor production. The company has gained traction in advanced packaging-related lithography chemicals and process materials used in heterogeneous integration and chiplet manufacturing.

DuPont remains a major participant in ancillary semiconductor chemicals and advanced lithography materials following expansion of its electronics and industrial segment. The company’s offerings include photoresists, dielectric materials, anti-reflective coatings, and semiconductor cleaning chemistries. DuPont has been increasing focus on advanced packaging materials linked to AI processor manufacturing.

Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market Share by Market Players

The market structure varies significantly between advanced EUV materials and conventional mature-node photoresists.

Company	Estimated 2026 Market Share	Major Product Focus
JSR Corporation	17%–19%	EUV resists, ArF immersion resists, anti-reflective coatings
Tokyo Ohka Kogyo	14%–16%	ArF/KrF photoresists, developers, specialty lithography chemicals
Shin-Etsu Chemical	10%–12%	Semiconductor lithography materials, high-purity ancillary chemicals
Fujifilm Electronic Materials	9%–11%	Photoresists, advanced packaging chemicals, wet process materials
DuPont	7%–9%	Ancillary semiconductor chemicals, dielectric and packaging materials
Others	28%–32%	Regional and niche suppliers

Advanced EUV-compatible photoresists remain the most consolidated segment because manufacturing complexity is substantially higher than conventional KrF or i-line resist production. In contrast, mature-node lithography materials show broader supplier participation, particularly in China where domestic manufacturers are increasing output for automotive and industrial semiconductor applications.

Product Portfolio Differentiation Becoming More Important in Advanced Semiconductor Manufacturing

Competition in the Photoresists and Ancillary Chemicals for Semiconductor Manufacturing Market increasingly depends on formulation specialization rather than only production scale. Semiconductor manufacturers are demanding lower stochastic defects, higher resolution capability, and tighter process uniformity as logic geometries continue shrinking.

EUV photoresists now require compatibility with high numerical aperture lithography systems being introduced for next-generation advanced semiconductor production. Several suppliers are investing in metal-oxide resist technologies and alternative chemically amplified formulations capable of supporting sub-2 nm transistor architectures.

Ancillary chemicals are also becoming more technologically differentiated. Developers and removers used in advanced patterning processes must maintain compatibility with sensitive wafer structures and increasingly fragile low-k dielectric materials. Semiconductor fabs are prioritizing process chemicals with lower defectivity and reduced residue formation because yield losses at advanced nodes are financially significant.

Advanced packaging has emerged as a major competitive opportunity for suppliers. Thick-film photoresists used in redistribution layers, wafer-level packaging, and chiplet integration are experiencing strong demand growth. Packaging-related chemical demand is expanding faster than conventional front-end lithography demand in Taiwan and South Korea due to rapid AI accelerator deployment.

Chinese Manufacturers Expanding Presence in Mature-Node Semiconductor Chemicals

Chinese suppliers are increasing participation in mature-node lithography materials and ancillary semiconductor chemicals. Domestic semiconductor ecosystem expansion has accelerated demand for locally sourced KrF and ArF resist materials. However, China still remains heavily dependent on Japanese suppliers for EUV-compatible photoresists and advanced semiconductor purification technologies.

In September 2025, Beijing Kehua Microelectronics Materials expanded semiconductor photoresist manufacturing capacity focused on mature-node semiconductor production. The expansion supported domestic automotive and industrial semiconductor manufacturing growth.

Several Chinese companies are also investing in semiconductor-grade solvent purification and filtration systems between 2024 and 2026 to reduce import dependence. Despite these efforts, advanced lithography material qualification at leading-edge fabs remains challenging because of strict contamination and yield requirements.

Recent Industry Developments and Strategic Expansion Activities

In April 2026, Taiwan Semiconductor Manufacturing Company accelerated installation of advanced EUV production tools for next-generation node manufacturing in Taiwan, increasing projected consumption of EUV photoresists and specialty developers across its fabrication network.

In December 2025, Samsung Electronics announced additional investment in advanced memory packaging infrastructure linked to HBM production growth. The move increased regional demand expectations for lithography chemicals used in advanced packaging and wafer patterning.

In October 2025, Fujifilm Holdings expanded semiconductor materials production infrastructure in Japan targeting advanced packaging and semiconductor cleaning chemical demand.

In July 2025, Intel Corporation continued expansion of advanced semiconductor manufacturing facilities in the United States under CHIPS Act-supported investment programs, supporting long-term domestic demand for semiconductor lithography chemicals and ancillary materials.

In February 2026, SK hynix increased HBM-related wafer processing capacity to address AI server demand growth, contributing to higher consumption of ArF immersion photoresists and associated stripping chemistries.